Multi-compartment electrical apparatus with shared cooling assembly

ABSTRACT

An apparatus, such as a power routing apparatus, includes an enclosure having first and second compartments having respective first and second opposing walls. A cooling structure is disposed between the first and second compartments and has a coolant passage defined therein configured to support a coolant flow in a direction parallel to the first and second opposing walls. First and second semiconductor switches (e.g., static switches) are disposed on the first and second walls on opposite sides of the coolant passage and are configured to be cooled by the coolant flow.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No.16/241,471; filed with the U.S. Patent and Trademark Office on Jan. 7,2019 which claims priority to U.S. Provisional Patent Application No.62/614,584, filed with the U.S. Patent and Trademark Office on Jan. 8,2018. The disclosures of which are hereby incorporated by reference intheir entireties.

BACKGROUND

The inventive subject relates to electrical equipment and, moreparticularly, to electrical power equipment including heat-generatingsemiconductor devices.

Electrical equipment, such as converters, static switches and otherapparatus used in power distribution applications, often includes powersemiconductor devices, such as transistors (e.g., IGBTs, power MOSFETs)or thyristors (e.g., SCRs). During operation, such devices can generatesignificant amounts of heat. To prevent degradation of such devices andother nearby electronics, this heat typically is transferred away fromthe device using heatsinks, convection, fans, liquid coolant systems,heat pipes and other thermal transfer structures. Provision of suchthermal transfer structures within confined spaces of cabinets or otherenclosures can be problematic as they can occupy an inordinate amount ofspace and may be subject to form factor constraints arising from theneed to provide a heat transfer path to the exterior of the enclosure.Accordingly, there is an ongoing need for improved thermal transferstructures in such applications.

SUMMARY

According to some embodiments of the inventive subject matter, anapparatus, such as a power routing apparatus, includes an enclosurehaving first and second compartments having respective first and secondopposing walls. A cooling structure is disposed between the first andsecond compartments and has a coolant passage defined therein configuredto support a coolant flow in a direction parallel to the first andsecond opposing walls. First and second semiconductor switches aredisposed on the first and second walls on opposite sides of the coolantpassage and are configured to be cooled by the coolant flow.

In some embodiments, the cooling structure includes at least oneheatsink having at least one heat transfer surface disposed in thecoolant passage, wherein the first and second semiconductor switchesthermally coupled to the at least one heatsink. The cooling structuremay further include at least one fan disposed between the first andsecond walls and configured to generate the coolant flow. The at leastone heatsink may be positioned in the coolant passage such that the atleast one heat transfer surface receives the coolant flow from the atleast one fan. The cooling structure may also include a duct configuredto exhaust coolant received from the heatsink. The cooling structure mayfurther include at least one vent on at least one of the first andsecond walls and configured to provide coolant from at least one of thefirst and second inner compartments to the coolant passage.

In some embodiments, the enclosure further includes third and fourthcompartments on respective first and second sides of the first andsecond compartments. The apparatus may include at least one input busassembly passing from at least one of the first and second compartmentsinto at least one of the third and fourth compartments and electricallyconnected to at least one of the first and second contactors. Theapparatus may further include first and second output bus assemblieselectrically coupled to respective ones of the first and secondsemiconductor switches and passing from respective ones of the first andsecond compartments to respective ones of the third and fourthcompartments.

According to some embodiments of the inventive subject matter, anapparatus includes a cuboid enclosure having first and second outercompartments and first and second inner compartments disposed betweenthe first and second outer compartments such that the first and secondinner compartments have respective first and second opposing verticalwalls. The apparatus further includes a cooling structure between thefirst and second vertical walls, The cooling structure includes acoolant intake structure configured to receive air from lower portionsof the first and second inner compartments, a fan assembly above thecoolant intake structure and comprising at least one fan disposedbetween the first and second vertical walls and configured to draw airthrough the coolant intake structure, a heatsink assembly above the fanassembly and having a plurality of heat transfer surfaces that receiveair from the fan assembly, and a duct above the heatsink assembly thatvertically exhausts air from the heatsink assembly out of the enclosure.

In some embodiments, first and second heat-producing devices aredisposed in respective one of the first and second inner compartmentsand thermally coupled to the heatsink assembly. The first and secondheat-producing devices may include respective first and secondsemiconductor static switches. The apparatus may further include firstand second contactors electrically coupled to respective ones of thefirst and second semiconductor static switches and disposed inrespective ones of the first and second inner compartments belowrespective ones of the first and second semiconductor static switches.In some embodiments, the apparatus may include at least one input busassembly passing from at least one of the first and second outercompartments into at least one of the first and second innercompartments and electrically connected to at least one of the first andsecond contactors and first and second output bus assemblieselectrically coupled to respective ones of the first and secondsemiconductor static switches and passing from respective ones of thefirst and second inner compartments to respective ones of the first andsecond outer compartments. First and second control circuit assembliesmay be mounted on respective ones of the first and second vertical wallsabove the first and second semiconductor static switches.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic diagram illustrating a power router apparatusaccording to some embodiments.

FIG. 2 is a front perspective view of a power router apparatus accordingto some embodiments.

FIG. 3 is a cutaway perspective view of a cooling structure of the powerrouter apparatus of FIG. 2.

FIG. 4 is a side view of the cooling structure of FIG. 3

FIG. 5 is a perspective view of the cooling structure and bus assembliesof the power routing apparatus of FIG. 1.

FIG. 6 is a detailed perspective view of lower portions of the coolingstructure of FIG. 3.

FIG. 7 is a perspective view of a fan assembly of the cooling structureof FIG. 3.

FIG. 8 is a perspective view of a heatsink of the cooling structure ofFIG. 3.

FIG. 9 is a perspective view of an exhaust duct of the cooling structureof FIG. 3.

FIG. 10 is a detailed perspective view of a contactor and input busassembly of the power routing apparatus of FIG. 1 according to someembodiments.

FIG. 11 is another detailed perspective an alternative contactor andinput bus arrangement for the power routing apparatus of FIG. 1.

FIG. 12 is a schematic diagram illustrating an exemplary application ofa power router apparatus according to further embodiments.

DETAILED DESCRIPTION

Specific exemplary embodiments of the inventive subject matter now willbe described with reference to the accompanying drawings. This inventivesubject matter may, however, be embodied in many different forms andshould not be construed as limited to the embodiments set forth herein;rather, these embodiments are provided so that this disclosure will bethorough and complete, and will fully convey the scope of the inventivesubject matter to those skilled in the art. In the drawings, likenumbers refer to like elements. It will be understood that when anelement is referred to as being “connected” or “coupled” to anotherelement, it can be directly connected or coupled to the other element orintervening elements may be present. As used herein the term “and/or”includes any and all combinations of one or more of the associatedlisted items.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the inventivesubject matter. As used herein, the singular forms “a”, “an” and “the”are intended to include the plural forms as well, unless expresslystated otherwise. It will be further understood that the terms“includes,” “comprises,” “including” and/or “comprising,” when used inthis specification, specify the presence of stated features, integers,steps, operations, elements, and/or components, but do not preclude thepresence or addition of one or more other features, integers, steps,operations, elements, components, and/or groups thereof.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this inventive subject matterbelongs. It will be further understood that terms, such as those definedin commonly used dictionaries, should be interpreted as having a meaningthat is consistent with their meaning in the context of thespecification and the relevant art and will not be interpreted in anidealized or overly formal sense unless expressly so defined herein.

FIG. 1 illustrates a power router apparatus 100 according to someembodiments. The apparatus 100 includes first and second static switchassemblies 120 a, 120 b, each of which includes antiparallel-connectedsilicon-controlled rectifiers. It will be appreciated that thisarrangement represents an example implementation of a static switch, andthat other semiconductor switches, such as power MOSFETs, may be used toprovide a similar switch functionality. Respective first and secondcontactors 110 a, 110 b are coupled to the static switches 120 a, 120 b,and may be used, for example, to selectively provide an input to thestatic switches 120 a, 120 b, as explained below with reference to FIG.12. It will be appreciated that other circuit interruption devices, suchas circuit breakers, may be used in place of the contactors 110 a, 110b.

FIGS. 2-9 illustrate a power router apparatus 200 having the electricalarrangement illustrated in FIG. 1. Referring to FIG. 2, the apparatus200 includes a cuboid cabinet-like sheet metal enclosure 210, which hasfour compartments 212, 214, 216, 218 defined therein. Inner compartments214, 216 house static switches 230 a, 230 b, contactors 240 a, 240 b andassociated control boards 270 a, 270 b in a mirror image arrangement onrespective sides of a columnar cooling structure 220 disposed betweenthe inner compartments 214, 216. First and second output buses 250 a,250 b are connected to respective ones of the static switches 230 a, 230b and pass from the inner compartments 214, 216 into outer compartments212, 218, where they may be connected to cables or other conductors.Current transformers 233 for monitoring currents in the output buses 250a, 250 b may be housed within the inner compartments 214, 216. Usingthis compartment arrangement, components housed in the innercompartments 214, 216 may be shielded from arc flashes or otherpotentially damaging events occurring in the outer compartments 212,218, and potentially damaging events occurring on one side of theapparatus 200 may be isolated from components on the other side of theapparatus 200. As further illustrated, exterior control cabling forcomponents in the inner compartments 214, 216 may pass through the outercompartments 212, 218 via protected channels 219.

In the illustrated embodiments, the right side outer compartment 218also houses a common input bus 260 that feeds the contactors 240 a, 240b, and provides an enclosure for connection of cables or otherconductors to the common input bus 260. It will be appreciated, however,that other input bus arrangements may be provided, such as thosedescribed below with reference to FIGS. 10 and 11.

Referring to FIG. 3, the cooling structure 220 includes a heatsinkassembly 280, upon which semiconductor packages 232 (e.g., individualpackaged SCRs) of the static switches 230 a, 230 b are mounted.Referring to FIGS. 6 and 8, the heatsink assembly 280 includes threeblock-shaped heatsinks 282, each of which comprise parallel rectangularplates 281 a, 281 b upon which the semiconductor device packages 232 aremounted. The rectangular plates 281 a, 281 b are interconnected bythinner plates 283 that define a plurality of air channels between theplates 281 a, 281 b.

Referring FIGS. 2-9, air drawn by fan box 290 of the cooling structure220 enters through an intake structure including lower vents 310 a, 310b. The air passes upward through the fan box 290 and through the airpassages in the heatsinks 282. After passing through the heatsinks 282,heated air is exhausted through a vent 322 in the top of the enclosure210 via a duct 320 disposed between the control boards 270 a, 270 b.

This shared cooling arrangement can provide an efficient use of spacefor cooling. In some embodiments, for example, the static switches 230a, 230 b may not be used simultaneously, making such a shared coolingarrangement particularly advantageous because it can be sized to provideonly the cooling capability needed for operation of one of staticswitches 230 a, 230 b at a given time. This can further economize on theamount of space needed for the cooling system.

Referring to FIG. 5, a right-side common input bus 260 may be connectedto both the right and left side contactors 240 a, 240 b. However, insome embodiments shown in FIG. 10, a left-side input bus 260′ may beconnected to the contactors 240 a, 240 b to provide a left-sideconnection. In further embodiments shown in FIG. 11, right and left sideinput buses 260 a, 260 b may be separately connected to respective onesof the right and left side contactors 240 a, 240 b.

FIG. 12 illustrates an exemplary application of a power router apparatus100 as described herein. Converter modules 140 a, 140 b (e.g., invertermodules) are fed by a battery 150 and have outputs connected in commonto the contactors 110 a, 110 b. Respective ones of the static switches120 a, 120 b control respective outputs 130 a, 130 b. A third,un-switched output 130 c may also be provided.

In this specification, there have been disclosed embodiments of theinventive subject matter and, although specific terms are employed, theyare used in a generic and descriptive sense only and not for purposes oflimitation. The following claims are provided to ensure that the presentapplication meets all statutory requirements as a priority applicationin all jurisdictions and shall not be construed as limiting the scope ofthe inventive subject matter.

The invention claimed is:
 1. An apparatus comprising: an enclosurehaving first and second compartments having respective first and secondopposing walls; a cooling structure between the first and secondcompartments and having a coolant passage defined therein configured tosupport a coolant flow in a direction parallel to the first and secondopposing walls; first and second semiconductor switches on respectiveones of the first and second walls on opposite sides of the coolantpassage and configured to be cooled by the coolant flow; first andsecond contactors disposed in respective ones of the first and secondcompartments on respective ones of the first and second walls andelectrically coupled to respective ones of the first and secondsemiconductor switches; and at least one vent on at least one of thefirst and second walls and configured to provide coolant from inside atleast one of the first and second compartments to the coolant passage.2. The apparatus of claim 1, wherein the at least one vent comprisesrespective first and second vents in respective ones of the first andsecond walls.
 3. The apparatus of claim 1, wherein the cooling structurefurther comprises at least one fan disposed between the first and secondwalls and configured to generate the coolant flow.
 4. The apparatus ofclaim 1: wherein the first and second walls comprise respective firstand second vertical walls; wherein the at least one vent comprise firstand second intake vents in lower portions of respective ones of thefirst and second vertical walls; wherein the first and secondsemiconductor switches are disposed above the first and second intakevents; and wherein the apparatus further comprises at least one fanpositioned in the coolant passage between the first and secondsemiconductor switches and the first and second intake vents.
 5. Theapparatus of claim 4, further comprising a heatsink positioned in thecoolant passage above the at least one fan, and wherein the first andsecond semiconductor switches are mounted on respective first and secondsurfaces of the heatsink.
 6. An apparatus comprising: an enclosurehaving first and second compartments having respective first and secondopposing walls; a cooling structure between the first and secondcompartments and having a coolant passage defined therein configured tosupport a coolant flow in a direction parallel to the first and secondopposing walls; first and second semiconductor switches on the first andsecond walls on opposite sides of the coolant passage and configured tobe cooled by the coolant flow; first and second contactors electricallycoupled to respective ones of the first and second semiconductorswitches and disposed in respective ones of the first and secondcompartments; and at least one vent on at least one of the first andsecond walls and configured to provide coolant from inside at least oneof the first and second compartments to the coolant passage, wherein theenclosure further comprises third and fourth compartments on respectivefirst and second sides of the first and second compartments, and whereinthe apparatus further comprises at least one input bus assembly passingfrom at least one of the first and second compartments into at least oneof the third and fourth compartments and electrically connected to atleast one of the first and second contactors.
 7. The apparatus of claim6, wherein the first and second semiconductor switches compriserespective first and second static switches.
 8. The apparatus of claim7, wherein the first and second static switches partially protrude intorespective openings in the first and second walls.